Homepage » Technology » Products »

Productivity innovations around SMT

Products
Productivity innovations around SMT

Yamaha Motor Co., Ltd. has developed the high-density mod-ular surface mounter model „YSM40“. Adopting a 4-beam, 4-head layout on a compact platform with a width of just 1 meter, this model achieves the industry’s top levels of mounting speed over 100,000 CPH (IPC9850) area productivity, as well as excellent flexibility of application in a variety of production formats. The system is a new concept of achieving a high level of area productivity and the ability to handle a wide range of components in one machine. This makes it a machine strategically positioned to best meet the growing need for high-speed surface mounters optimized for manufacturing the small to mid-sized PCBs used in rapidly spreading digital electronic products like smart phones and tablet devices. With features like 4- or 2-beam layouts, three different types of heads and a single or dual-lane conveyor layout allowing for a great variety of work variations. The compact machine width of just one meter means outstanding area productivity and line length productivity. Furthermore, a number of new functions are provided by devices like a tray-components supply carriage that enables changing of all pallets at once. Additionally, the newly developed electric-po-wered „ZS“ tape feeder is 30 to 40 percent faster than its predecessor, is forward and backward compatible and allows for replacement while the machine is running. Two innovations work together to maximize machine production availability.

The YSP20 is a dual stage, dual lane, dual stencil solder paste printer developed to achieve a 5 second cycle time, plus a variety of new functions. Building on the superior printing quality and functionality of Yamaha’s high-end 3S head fitted “YSP” solder-paste printer, the YSP20 adopts a new dual-stage, dual-stencil mechanism. In addition to more than doubling the printing speed compared to the previous model, the new system also enables unique functions such as non-stop changeover, sequential printing and asynchronous processing, allowing for truly independent operation of a complete dual lane SMT line.
Additionally the company introduce the All-In-One Automated 3D X-ray, Optical, Infrared and Laser Inspection Machine. This hybrid machine has a vision system which takes optical, laser and X-ray images targeting only the most suitable areas for each type of vision. Using Computer Laminography (CL), it is a fast and effective 3D inspection system and the first that can do full X-ray + optical inline inspection at the same time. The patent pending pulsed CL makes it possible with few shots to reproduce full 3D image in horizontal and vertical slices within 4 seconds. The patent pending direct panel detector reduces inspection time and potential radiation damage to components. Using lower power and pulsed X-Rays, this machine extends the lifetime of source and detection sensors to 4 years at full day usage. The optical camera has a 3 angle x 3 color array of RGD and Infrared LED’s. The 3rd dimension on this machine is the use of laser height sensor, to detect co-planarity on leads or flatness of ball components. All of today’s inspection solutions can tell what has gone wrong, but cannot tell where it went wrong. SMT Lines with Inspection Machines from the company can work with the QA Option Software to warn operators immediately of a problem indicating the machine, the component, the feeder position, the placement head and the pickup nozzle. This solution truly works to minimize the number of defect PCB’s, instead of merely screening out defective boards for repair. With over 23 years’ experience of selling Yamaha IM Machines in Asia, 170 total employees in 12 countries, the company is excited for having Trans-Tec becoming partner in North America. Opened up for business in March, 2012 at their new location in Chandler, Arizona, Trans-Tec offers a third source for Yamaha service, support and parts, as well as demonstration and training facilities in North America.
SMT Hybrid Packaging
Booth 7-555
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
READ
Newsletter

Subscribe to our newsletter now

Webinars & Webcasts

First hand technical knowledge

Whitepapers

Find all current Whitepapers here

Videos

Find all current videos here


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de