MPL3100/3200 BGA and QFP Placer are manual or semiautomatic placer specialized for CSP, BGA and QFP placement. The vision system with split optic enables picture overlay of board and component for easy alignment. Motorized axis provides automatic placement for prototyping, small batch production, and rework. The image overlay alignment system enables users to precies fine pitch placement of BGA and micro-BGA. Complex components such as BGA or QFP require special optical aids for placement, even for manual or semiautomatic placement for prototypes or small batches. The Microplacers MPL3100 and MPL3200 are versatile placement machines for such applications. They allow highly accurate placement of components with high lead count as well as very small components. The MPL3200 is equiped with a placement force control system, with an automatic pickup and placement system and a versatile substrate holder.
SMT/Hybrid/Packaging Booth 7-203
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