Atron AC 205 belongs to the newly developed FAST technology based cleaning agents and is specifically recommended for the removal of flux residues from assemblies in spray-in-air applications. FAST technology based cleaning agents are a new generation of surfactants, which move faster on the surface than traditional surfactants. This results in an very high wetting ability, so that all residues of the latest lead-free and eutectic no clean solder pastes are removed efficiently. Besides the advantage in speed, Atron AC 205 has a higher bath loading capacity compared to conventional surfactants, which results in a longer bath life time, reduced cleaning agent consumption and less necessary bath changes. Additionally, the cleaner has a user-friendly formulation and it has no flashpoint, a mild odor and is formulated free of any hazardous substances.
EPP Europe 457
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