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Pb-free, no clean solder paste for automotive electronic applications

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Pb-free, no clean solder paste for automotive electronic applications

Pb-free, no clean solder paste for automotive electronic applications
Cookson Electronics Assembly Materials has recently launched its new automotive Pb free paste, developed primarily for “Under the Hood” applications. Alpha OM-350 with InnoLot Alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints, even when these joints are exposed to extreme conditions, such as the high temperatures and vibration that is becoming the norm for engine mounted modules.

In Consortium sponsored studies, where assemblies were subjected to extreme thermal cycling under vibration, solder joints made with Alpha OM-350 with InnoLot alloy, showed improved resistance to mechanical failure versus SAC 387. “We are responding to the automotive industry need to increase electronic system reliability while decreasing the weight and complexity of wiring harnesses,” said Cookson Electronics’ Global Product Manager, Mitch Holtzer.
Alpha OM-350 with InnoLot Alloy shows improved performance over SAC 387 based lead free solder, which can be important in applications like engine-mounted control modules where extreme temperature variations and vibration are commonplace.”
InnoLot Alloy is a patented, 6 part alloy with a reduced melting point versus SAC 305, and is already being tested at a number of the large automotive electronic producers around the globe.
EPP Europe 535
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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