The need to control the paste printing process is ever increasing. Rising numbers of hidden solder joints and a need to improve and ensure solder joint quality are the key factors to implement in-line-process-control. The decision faced by each process and manufacturing team is to select between a 2 D-inspection and a 3 D-measurement system.
2D-systems are typically based on scanners or line scan cameras and their resolution is adequate for 0603 components and pitches of 0.63 mm. The systems commonly use simple pixel comparison and therefore only detect area based defects such as missing solder paste, smear and bridging. The programming is based on greyscale values and the quality of test programs depends on the programmer, but changing colour of the solder paste and the PCB impact the overall call rate. Decisions for 2D-systems are mostly made due to low initial investment cost and high speed. 3D-systems typically measure height, area, volume and offset very accurately and most systems display the paste topography in 3D. Beyond the exact measurement values for insufficient or excess solder paste this allows to check the shape of the applied paste. Accurate measurement of the above attributes is required for process control and improvement. Detecting and eliminating systematic and random paste defects is essential so no defective PCB propagates down the manufacturing line. Only measurement of 100 % of the paste deposits will ensure this. Only accurate measurement of all deposits allows statistical process control and corrective action. Koh Young Technology provides highest accuracy and reliability of the data, with volume accuracy of ± 2 % and height accuracy of ± 2 µm at 3 sigma respectively. While conventional triangulation methods are burdened with shadow due to their single sided projection, Koh Young overcomes this obstacle though its unique double sided projection, resulting in shadow free images. For the true 3D-measurement-system, no programming is required, just the set-up of customers process tolerances. Accurate, shadow free measurement also means no false fails or escapes that are common with inspection systems. The graphical user interface provides clear and easy to understand graphical feedback of defects found and statistics of the measurements for the last PCBs. The latest model Aspire combines the proven measurement accuracy and reliability of the predecessor, the KY-3030 series with a new high-speed gantry system and the latest camera technology. The result is measurement performance enabled by shadow free imaging, which keeps pace with the fastest SMT manufacturing lines. The new platform concept allows the customer to select the right solution for their production needs, such as single and dual-rail conveyors. Even a later changeover or upgrade of the system is possible without any problems. New and enhanced SPC software will strengthen Aspire‘s position as a process control system. Customers are enabled by the SPC feedback to make process improvements to all aspects of the print process, including equipment, tools and materials.
SMT, booth 7-513, 7-521, 7-639
EPP Europe 412
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