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Panacol launches new range of low temperature curing epoxies

Electronics Adhesives
Panacol launches new range of low temperature curing epoxies

Panacol launches new range of low temperature curing epoxies
The new Structalit® 5511 is suitable for connector sealing (adhesive shown in light blue in the graphic) Source: Panacol

International supplier of adhesives and UV processing systems, Panacol, has developed a range of one component epoxy adhesives that cure at only 60°C. According to the company, they have been developed specifically for electronics applications and adhere very well to substrates with low surface energy. The new range of epoxy adhesives are known as Structalit 5511, 5521 and 5531 and exhibit a unique set of physical properties after reaching full cure which allow the adhesives to be optimised for use with various component geometries, substrates, and operating functions, the company said.

All three adhesives are single-component, epoxy resin-based adhesives and cure at just 60°C. This makes them particularly suitable for temperature-sensitive electronic components, Panacol explained. Curing at higher temperatures will accelerate cure time and add additional strength to the bond. According to the company, the new Structalit adhesives generate very high bond strength with materials typically used in the electronics industry. They also adhere very well to LCP (liquid crystal polymer) and other high-tech plastics with low surface energy. The company also confirms that all three adhesives possess high purity and low ion content which complies with international standards for electronic and microelectronic component assembly.

“The Structalit 5511 adhesive features a particularly low ionic content and is therefore especially suitable for use in electronics,” the company said in a press release. “Combining a high Young‘s modulus with an elongation at break of more than 8%, it ensures high adhesion to many substrates with additional shock and vibration resistance.”

“Structalit 5521 is softer and more flexible after curing, allowing the adhesive to better compensate for stresses between substrates. Due to its very low modulus of elasticity, this adhesive is very well suited for potting or for the application of thicker adhesive layers.

“As the third adhesive in the new epoxy technology range, Structalit 5531 has an extraordinarily low coefficient of thermal expansion (CTE), yet is flexible enough to withstand drop and vibration tests. The incorporation of filler particles gives the adhesive extremely high resistance to mechanical and chemical influences,” the company added.


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