Vacuum plus is a new system for optimising soldering joints. Besides the integration in an SMT Reflow Soldering System the autonomous module can be retrofitted in existing machines without problems due to the modular design of the SMT Reflow Soldering Systems. Vacuum plus is inserted immediately after the peak zone, and can be enabled when required. The continuous reflow pass is then automatically changed to vacuum operation. The product is subjected to a vacuum for a short period during the soldering process. Inclusions in the soldering joint are reduced to a minimum, which improves the quality of the product significantly.
Productronica A4/159
eppe419
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