With the S3088-III, Viscom brings the newest version of the S3088 system family to the market. This AOI system is optimized for fast, highly accurate solder joint inspection with the well-known high Viscom inspection depth. In addition to its highly accurate and fast solder joint inspection, the S3088-III can also be deployed for paste print or placement inspection. Thanks to the further improved positional accuracy, even the smallest defects on 01005 components are detected in high resolution mode with precise reliability. The revised PCB transport now allows larger boards to be inspected, up to 508 x 508mm (20“ x 20“). The system can also be optimally equipped for extreme cycle time requirements or heavier PCBs. Extended lifted lead detection reduces false alarms caused by poorly stamped edges. Naturally the S3088-III also comes equipped with the familiar Viscom software modules, such as switchable resolution with the On Demand HR function or Integrated Verification for automatic inspection program optimization.
Productronica A2/177
eppe445
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