Advantest Corporation announced that a new mold thickness metrology system, the TS9000, for measuring the thickness of semiconductor packaging, is available for purchase. The system is based on advances in Terahertz (THz) technology pioneered by the company. The TS9000 Mold Thickness Analysis (MTA) System is a new metrology tool that performs non-destructive analysis of the thickness of semiconductor packaging. Meeting the high standards of speed and accuracy required for high-volume manufacturing, its innovative inspection capabilities are expected to contribute significantly to product quality improvement amid the trends towards smaller device sizes and higher integration, driven in part by the widespread adoption of smartphones and tablets. Already installed and in use, the system heralds a new product family of analysis systems for high-volume manufacturing. Future systems from the THz product family will target the pharmaceutical, automotive, ceramic and other industrial markets in addition to semiconductors. The company is leveraging its leading capabilities in terahertz technology to bring cutting-edge non-destructive analysis to industrial production lines. In addition to strip units, the highly adaptable TS9000 supports measurement of individual devices handled using industry standard JEDEC trays, making it flexible and compatible with existing sample handling methods.
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