Indium Corporation is pleased to introduce SACM, a new solder alloy. SACM is a high-reliability solder alloy that offers drop test performance far superior to other SAC alloys, without compromising on thermal cycling and, at a cost below that of typical SAC solder alloys. The electronics assembly market has demanded a solder alloy that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost. Traditionally, alloys that excel in one area are weak in another.
The invention of SACM offers superior drop test performance versus SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to SAC305. This provides manufacturers with an affordable high-reliability SAC solder alloy. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices. It is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially for cost-sensitive applications.
According to Tim Jensen, global product manager for Indium Corporation’s PCB assembly products, “SACM provides manufacturers with a Pb-free alloy that offers greatly-improved reliability, while helping to control the cost volatility associated with traditional SAC alloys.”
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