The Balver Zinn Group exhibited at SMT Hybrid Packaging and highlighted the latest products, technologies and services.
The company is a pioneer in lead free solders and they presented Nihon Superiors new patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C has been improved by the addition of bismuth, which has positive effects on the reliability of the solder joints. The SN100CV alloy offers high reliable solder joints, which are recommended for high-end and automotive electronics.
Also at the show, the company introduced a wide range of adhesives for different electronics applications such as semiconductor assembly, automotive and consumer electronics. SMTA-0240 is a solvent-free, one component, pre-mixed, thermoset epoxy based adhesive. It has been designed especially for the bonding of surface mount devices, to printed circuit boards, prior to the wave soldering process.
SMTA-0240 is characterized by excellent stencil print-ability, resulting in high dot profiles, without aperture-stringing or tailing. It can resist temperatures over 200º C for short periods of time and has been used in lead-free processes with peak temperatures of 270º C.
The group also introduced the latest flux technology Cobar BF-1301 wave soldering flux.
Cobar BF-1301 is an alcohol based organic flux technology which exhibits exceptional wetting in combination with highest possible SIR of the residues. Using this flux in a nitrogen atmosphere will lead to the lowest residue, which is very beneficial for pin testability, and coat ability of the products. Higher first pass yields will be achieved and will reduce the cost of production.
Also on display at SMT Hybrid Packaging was the Cobar solder paste, Spectrocheck DEMO-machine and live soldering sessions with Hakko soldering stations.
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