AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, participated at SMT Hybrid Packaging show. The company highlighted their revolutionary REL61 lead-free solder alloy, along with their full line of solder assembly materials.
REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers. Combined with the company’s M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45 %, increasing both thermal performance and solder joint integrity. It offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and low/no-silver solder alloys. Extensive testing indicates that REL61 can reduce tin whisker formation, as well as, outperform SAC alloys in thermal shock, vibration, and drop shock resistance.
The company also highlighted its full line of advanced solder materials, including solder paste, liquid flux, and solder alloys, including its newly developed REL22 solder alloy for extremely harsh environments.
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