AIM, a global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, showed its NC258 lead-free and tin-lead solder paste. The most robust solder paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. It reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. Additionally, the paste offers very low post-process residues that remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.
productronica, A2.435
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