Orbotech’s Paragon-SM 20 Laser Direct Imaging (LDI) system for bare printed circuit board (PCB) manufacturing is a high accuracy, fast throughput LDI solution for imaging Solder Mask layers in QTA and Sampling as well as HDI and Rigid-Flex/Flex applications. It ensures high yields and lower cost per panel while satisfying tight registration accuracy requirements with dynamic imaging modes. With positioning accuracy of ±12 µm (mm model) or ±0.5 mil (inch model), Paragon-SM 20 images even the tightest annular rings. The system includes a range of dynamic imaging modes to meet production demands. Its depth-of-focus of ±300 μm overcomes the most challenging surface topography changes and/or distorted PCB topography to ensure superior image quality on the solder mask layer. Paragon-SM 20 recognizes a wide range of different target types regardless of solder resist color to meet production requirements. The system has a user-friendly and intuitive graphic user interface for simple operation and seamless connectivity to CAM to ensure fast and easy set-up.
eppe###
Share:
