Vitronics Soltec announces the availability of the enhanced XPM3i Reflow System, offering improved performance in terms of ease of use, and lower cost of operation. The new system features a patented atmosphere re-circulation system that delivers nitrogen savings of up to 50 %. It also can be equipped with a new dual lane, dual speed conveyor option for higher throughput and greater throughput flexibility for the high-mix processing environment. Additionally, new software features make it even easier to set up and use, with more powerful tools and features, and an even friendlier GUI. The XPM3 product platform has proven its capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance, precise process control, and superior value for high production, 24 hours-a-day, 7 days-a-week environments. The reflow system is also equipped with the revolutionary new Autoset fast setup feature. Autoset leverages years of process knowledge developed in reflow profiling by the company. Autoset makes it possible for the manufacturing engineer to accelerate process development by generating a preliminary reflow recipe based on a PCB assembly’s physical characteristics. The engineer can then ‘fine tune’ the preliminary recipe if needed. However, 85 % of the time the engineer doesn’t need to modify the auto-created recipe at all.
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