Viscom’s S6053BO-V brings the newest generation of fully automatic wire bond inspection systems to market. The inspection system was conceived specifically for small wire bond analysis. Both the camera technology as well as the transport can be adapted to the most widely varying production demands. The wire bond AOI system is equipped with a universal, high-resolution VHR camera module. These high quality optics make it possible to inspect down to a resolution of 2 to 5 µm per pixel. The camera module can be arrayed with one or several cameras and specialized illumination units. Thus, even bond wires smaller than 20 µm in diameter can be inspected 100 %. (The figure shows a bare chip with thin gold wire bond.)
If faster cycle times are required, the S6053BO-V machine is available in a dual track configuration. The dual track system includes an integrated shuttle which loads the second track as an inspection is conducted on the first track. This innovative transport concept fulfills demands for the fastest cycle times.
The design is configured for extremely fine bond wire analyses, yet it can be utilized wherever small structures must be resolved with precise accuracy. This opens up the inspection scope beyond the inspection of wires. Components and ASICs are also inspected with the same high accuracy. Of course the inspection scope includes all classical inspection tasks associated with die and wire bonds.
One of the greatest benefits is Viscom’s image processing capability to reliably identify defects even on very small mechanical components and to measure them when required. This technology allows high-precision accuracy at high speeds.
EPP Europe 556
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