Nordson Dage, a division of Nordson Corporation, highlights its 4000Plus multi-purpose bondtester which represents the industry standard in bond testing with unsurpassed data accuracy and repeatability. The system is suitable for the full spectrum of traditional bond tests as well as meeting the requirements of emerging test applications including ribbon pull, bend and fatigue testing and pad cratering using hot pin pull. The 4000Plus Pad Cratering system is in accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications. The bondtester uses the next generation Paragon software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.
Share:
