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Indium Corporation unveils no-clean adhesive for reflow processes

Adhesive solutions
Indium Corporation unveils no-clean adhesive for reflow processes

Indium_NC-702_syringes.jpg
The new adhesive is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, the company said Source: Indium Corporation

Indium Corporation, a manufacturer and supplier of raw materials and compounds to the global electronics manufacturing industry, has released a no-clean, near-zero residue, halogen-free adhesive solution designed for holding parts in place during placement and reflow processes. The new product is known as NC-702.

Designed for use in a formic acid reflow environment, the company says the new adhesive is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution over pick and place investments.

While the new formulation has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.

According to the company, benefits of the new solution include:

  • No evidence of contamination during reflow, enabling use in formic acid reflow environments without risk of damaging equipment
  • Flexible application method via dipping, dispensing, or jetting, potentially reducing process costs
  • Minimal voiding present and good soldering performance; although classified as an adhesive solution, NC-702 does not negatively affect soldering performance
  • Compatible with molding and underfill material
  • Compatible with most common SAC alloys

www.indium.com

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