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Indium Corporation introduces cleanable solder paste

Pastes for fine feature printing
Indium Corporation introduces cleanable solder paste

Indium Corporation introduces cleanable solder paste
The company says the new paste features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80μm Source: Indium Corporation

Materials refiner, smelter, manufacturer Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.

According to the company, the paste known as SiPaste C201HF combines industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. “It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.”

The paste features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80μm and delivers:

Consistent and tight solder deposit spread across multiple prints; excellent response-to-pause performance

  • Minimal voiding on tight-pitch components, ensuring joint strength on small components
  • Excellent reflow performance on components that exhibit high warpage
  • Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
  • Flexible cleaning; can be used in processes that require cleaning with a saponifier or that do not require cleaning

www.indium.com

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