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Hensoldt and Nano Dimension create multi-layer PCB with 3D printing

Boosting electronics rapid prototyping
Hensoldt and Nano Dimension create multi-layer PCB with 3D printing

Hensoldt and Nano Dimension multi-layer PCB
Hensoldt and Nano Dimension have collaborated together and succeeded in assembling a 10-layer printed circuit board. Source: Nano Dimension

Sensor solutions provider Hensoldt together with the Additively Manufactured Electronics (AME)/Printed Electronics (PE) provider, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in assembling a 10-layer printed circuit board (PCB), which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two-sided population of components.

“Military sensor solutions require performance and reliability levels far above those of commercial components.” says Hensoldt CEO, Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”

“Nano Dimension’s relationship with Hensoldt is the type of partnership with customers we are striving for,” commented Yoav Stern, Nano Dimension President & CEO. “Working together and learning from Hensoldt led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (High Performance Electronic Device) that create competitive edges by enabling unique implementations with shortest time to market.”

AMEs are useful to verify a new design and functionality of specialized electronic components before production. It is a highly agile and individual engineering methodology to prototype a new electronic circuitry. This leads to significant reduction of time and cost in the development process. Furthermore, AME allows for a verified and approved design before production starts, leading to higher quality of the final product.

The collaboration first started in 2016, in order to examine the possibilities of 3D printing electronics. Last year, Hensoldt successfully implemented the Nano Dimension’s DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, an additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.


Company contact

Hensoldt
Voltage, 6 Mollison Avenue
Enfield, EN3 7XQ United Kingdom
Tel.: +44 19 9280–5200
Website: www.hensoldt.net

Nano Dimension
2 Ilan Ramon St.
Ness-Ziona Science Park
Ness Ziona 7403635, Israel
Website: www.nano-di.com

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