Henkel has recently introduced the Bergquist gap filler 4500CVO. This solution combines excellent thermal performance, a high dispense rate and controlled volatility. Designed as a two-component material, the thermal gap filler is built on a silicone chemistry platform that is easily dispensed for high-throughput operations. The product has a high thermal conductivity of 4.5 W/m-K, thoroughly wets out for optimized heat transfer and can be used without fear of contamination.
This two-part, high performance liquid gap filling material will cure at room temperature. Curing can also be accelerated with the addition of heat. It also has controlled volatile outgassing silicones for sensitive applications and high dispensing rate in customer application. This liquid-dispensed material offers infinite thickness variation and impart little and reduced stress on components during assembly. As cured, Bergquist gap filler TGF 4500CVO offers a soft, thermally conductive, form-in-place elastomer to fill voids and gaps in the customer assembly.
Other benefits include:
Performance and processability:
- High throughput – accurate dispensing of 300 g/minute (pattern dependent)
- Optimized viscosity for automated dispensing processes
- Easy and robust mixing ratio
Thermal control
- Thermal conductivity of 4.5 W
- Improved power output through high thermal conductivity and thorough wet out/gap filling
Long term reliability
- Safe for delicate devices with low assembly stress and low strain on PCBs and solder joints
- Minimal thermal changes at temperature up to 200 °C
- Good wet out to various surfaces and topographies
- Stable heat path in thermal cycling conditions
Volatility
- 300 ppm volatile silicones for sensitive applications
- Eliminates fouling and contamination concerns; safe and effective for use with optical components, mechanical contacts and sensitive environments such as semiconductor or surface finish operations
Environmental sustainability
- Room temperature storage
- Provides benefits through logistics and operations chain
Total cost of ownership
- Improved supply chain versatility, application adaptability, cost-effectiveness and performance as compared to thermal pads of similar thermal conductivity
Henkel Corporation
Henkelstraße 67
40589 Düsseldorf
Tel.: +49 211 797 0
E-Mail: corporate.communications@henkel.com
Website: www.henkel-adhesives.com
