Kulicke & Soffa Industries, Inc. has announced the launch of RelMax, a new 2 N gold ball bonding wire developed in response to market demand for increased interconnect (IC) reliability, process robustness and reduced costs.
“RelMax provides first bond intermetallic stability as attested to by high temperature storage tests. The gold bonding wire achieves softer, more concentric Free-Air-Balls for use in low-k and sensitive die applications” notes Dr. Zhang Xi, gold wire product manager. “It delivers superior bonding performance for both, the first and second bonds with higher mean-time-between-assist (MTBA) rates compared to other 2N gold wires. RelMax achieves robust bonding processes with significantly improved second bond stitch pull values at lower bonding parameters compared to other 2N wires.”
“These features enable customers to exploit lower cost assembly approaches such as the use of smaller wire diameters and metal substrates even for fine pitch applications, while maintaining stable wire-bonding processes and ball-bond reliability. This makes RelMax pre-destined for ultra-fine pitch applications, as well”, explains Klaus Dittmer, K&S Vice President, Wire Business Unit GM. The new gold wire will be available in diameters ranging from 15 um to 30 um.
EPP Europe 542
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