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Fully equipped for laser-structuring of molded interconnect devices

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Fully equipped for laser-structuring of molded interconnect devices

Fully equipped for laser-structuring of molded interconnect devices
Designed for 24/7 operation, the LPKF Fusion3D is fully equipped for the laser-structuring of molded interconnect devices (MID). The laser system increases the economic advantages of the LDS production method and makes production runs with high quantities economical for all kinds of applications. The Fusion3D laser system structures complex three-dimensional electronic components (MID) from multiple sides – with up to four laser heads simultaneously. This reduces laser structuring time and eliminates the time needed for rotating the components. The system works with mass production to replace the inflexible tool-based production methods like insert molding or two-component injection molding. In the production of time and cost sensitive applications, the LDS method reduces initial costs substantially and gains valuable time in the design and start-up phase. Setup and changeover to a different part is done quickly. The production data is stored with all parameters, for easy access at any time. The machine software automatically distributes the processing data to each individual laser head, optimizing the cycle time. The automated part handling ensures speed, accuracy and repeatability while keeping personnel cost to a minimum.

SMT/Hybrid/Packaging
Booth 6-320
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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