In addition to the desktop variant MX100 IR, Viscom also offers the MX2000 IR system with automatic handling. This is a good solution for inspecting medium and large lots in semiconductor manufacture. The application scope for the MX2000 IR inspection system includes MEMS, wafer bonds and Flip-Chips, as well as photovoltaic products. The wafers can be composed of various materials: silicon, gallium arsenide, aluminum oxide or III-IV composite semiconductors and others. Wafers are loaded for inspection and unloaded by a robot. For 150 and 200 mm wafers, one to four cassettes holding up to 25 wafers each can be loaded automatically. For 300 mm wafers, FOUP stations (Front Opening Unified Pod) are available; in this case, the robot takes the wafer directly from the station. Wafer identification and pre-alignment are done parallel to inspection. Thus, the system is especially well suited for inspection of medium to large lot sizes.
The core of the MX product series is its patented Si-Thru technology, whose light sources generate highly efficient illumination in the near-infrared range. Silicon with most types and concentrations of doping is transparent to light within this range, so even subsurface defects can be inspected easily. Additional system highlights include: scalability; high performance capability; and high-resolution light sources. Program generation and maintenance are quickly and easily accomplished through the graphical user interface (GUI).
Evaluation is based on specialized inspection algorithms which positively locate defects such as voids, seam widths, etc. Complete statistical process control and integrated process control (barcode, data matrix code, OCR) allow each individual wafer to be directly identified.
EPP Europe 467
Share:
