Flexible and fast wedge bonder for both ribbon and wire bonding

The Bondjet BJ820 from Hesse & Knipps is a high-speed, fully automatic wedge bonder that offers the ultimate in flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform – including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive – using aluminum or gold wire or ribbon. According to the company it is the fastest wedge bonder on the market. Bondjet BJ820 offers bond speeds up to 7 wires/second. With axis repeatability of 1 μm at a balanced encoder resolution of 20 nm, it provides increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. A highly versatile 12 ” x 16.1 ” work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, parallel bond stations in one work area can eliminate significant indexing time, resulting in 60 % greater throughput than competing machines.

“The Bondjet BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology,” notes Joseph Bubel, President, Hesse & Knipps, Inc. “Combining its high bonding speeds, large work area and intelligent automation solutions, the wedge bonder offers the potential for the highest throughput on the market.”

Other significant machine capabilities include:

“The Bondjet BJ820 defines the benchmark in the industry by offering the fastest wiring speed, largest work area and greatest axis accuracy among its competition,” summarizes Bubel. With a footprint of only 720 x 1250 mm, the bonder can be easily integrated into existing floor plan configurations or new concepts.

EPP Europe 541