Viscom launched the new Viscom S3088 ultra 3D-AOI system which combines the flexibility of the AOI systems of the S3088 family with the strengths of the high-performance camera module XM-3D, which makes it achieve unprecedented inspection speeds. Twice as fast as the predecessor systems of the S3088 family it additionally offers the most advanced 3D-measurement technology. It’s XM-3D sensor head features an integrated structured light projector for image fields of up to nine views. This permits exact 3D analyses of for example lifted leads, surface chips or IC coplanarity defects.
SMT Hybrid Packaging
Booth 7-203
Share: