Reinhausen Plasma was presenting the world’s very first process for chemical-free and energy-saving metallization and coating for a multitude of different materials – its nano-powder deposition technology, Plasmadust for short. The Plasmadust technology is based on a combination of cold-active plasma and nano or rather micro-powders. For the very first time coating processes using metal, polymer, semiconductor and other coatings can be carried out directly on two and three-dimensional substrates made of metal, plastic, silicon, glass, ceramic, paper, board and textiles with this new technology in a process that is completely free of chemicals, in other words VOC-free. It also eliminates the need for the etching and acid cleaning processes that are normally indispensable in classic surface processing. Practically any materials that can be pulverized and melted are suitable as coating materials; these include salt, gold, copper, aluminum, tin, bismuth, tellurite, CIGS, polymers, thermoplastics, glass and ceramic materials. In the case of printed circuit board production, Plasmadust technology makes it possible to apply circuit paths directly onto the board with the aid of a template. Other examples of applications for Plasmadust technology include ecological and efficient wafer coating, metallization and contacting of solar cells, the manufacture of flexible circuit boards and coatings for EMC shielding.
EPP EUROPE 534
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