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Exxelia introduces new high energy film capacitators

Passive components
Exxelia introduces new high energy film capacitators

The company says the ultra-high energy density film capacitors which it says save both space and weight while lowering the components count Source: Exxelia

Exxelia, a leading manufacturer of ruggedized passive components and sub-systems for demanding markets, has announced the introduction of MMLTM ultra-high energy density film capacitors which it says save both space and weight while lowering the components count.

The Miniature Micro-LayerTM (MMLTM) capacitors are what it calls “a breakthrough technology that allows tremendous size and weight reduction thanks to an unrivaled energy density.”

“Why is it a game changer? Because an unparalleled energy density of 400 J/dm3 allows for a tremendous reduction in size and weight compared to traditional Polypropylene or Polyester dielectrics, together with an increased operating temperature up to 140°C and transient voltage protection,” the company explained.

“MMLTM capacitors offer a large flexibility in design, easily allowing low profile configurations. Several studies have been conducted on actual cases of controls and DC-Links functions for aircraft applications. All have shown about 50% reduction in size and weight compared to other film technologies.”

MLCC demonstrates a “between 70% to 90% reduction in weight, while showing no capacitance derating with voltage applied and a low drift 5% through the temperature range. Applications using clusters of stacked MLCCs can now be replaced by a single MMLTM unit of similar size, with all of the increased reliability that film dielectric offers.”

The company adds that the MMLTM capacitors are perfectly suitable for power supplies, DC-links, AC/DC/AC power converters, charge/discharge or power generation functions of commercial/military aircraft, satellite platforms and payloads, launchers, defibrillators, downhole tools and any applications of confined electronics.

Features and benefits

  • Miniaturization of the function: Up to 50% size reduction vs other film technologies ; matching footprint with stacked MLCC
  • Lightweight : 50% lighter vs other film technologies ; 80 to 90% lighter than ceramic
  • No capacitance derating in voltage, stable in temperature (5% drift through the temperature range)
  • Capacitance from 1μF to 1000μF
  • Voltages from 50V to 1000V
  • Operating Temperature –55°C to +140°C
  • Highly customizable


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