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Epoxy preforms for sealing subminiature electronics

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Epoxy preforms for sealing subminiature electronics

Epoxy preforms for sealing subminiature electronics
Multi-Seals Inc. has introduced Nano-forms epoxy preforms to provide precision seals on microelectronics. With preforms as small as 0.035 ” (0.89 mm) outside diameter and 0.011 ” (0.28 mm) inside diameter, the epoxy preforms allow highly repeatable placement of minute amounts of epoxy with precision that is unattainable with traditional dispensing methods. With dimensional tolerances as close as ± 0.0005 ” (0.013 mm) for critical applications, Nano-forms can control epoxy volume to within 0.00002 cc for a typical configuration. Exceptional repeatability is further promoted with closely controlled pre-mixed ratios of resin to catalyst. In addition, epoxy preforms are not affected by pot life, so epoxy viscosity is consistent from beginning to end of production batch. This combination of precision and consistency makes Nano-forms ideals for sealing fiber-optics and subminiature switches, capacitors, diodes, LEDs, and other microminiaturized components. Like other Uni-forms epoxy preforms, Nano-forms are preshaped, one-part resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants.

EPP Europe 425
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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