It took less than 6 months for F&K Delvotec, based in Munich, to sell the first 50 units of their enhanced double-head wirebonder G5–2. The bonder is specially target for mass production of power semiconductors and offers, on a mono-chassis, two bonding systems in any combination of heavy and thin wire which can be exchanged by the user in minutes. The main novelty is the mono-chassis containing state-of-the-art materials. It excels at damping vi- brations from the linear motion units without taking resort to active vibration-canceling techniques which are expensive and complex. Sophisticated finite element simulations were run in order to optimize mass and force distribution in the chassis, in addition to fine-tuning the motion and control dynamics during touch-down and bonding in the framework of the patented Bond Process Control. “Our damping systems don’t work by mass, but through intelligence”, beams Dr Farhad Farassat, President and CEO of F&K Delvotec. The net result is that the bonder with two bond systems weighs in at roughly the same as competitors’ single machines which achieve vibration damping through sheer ballast mass. The customer benefits through further increased bond quality, and through unsurpassed bonding yields of better than 99,95 % which have now been routinely reached in practice by large manufacturers of power semiconductors.
SMT/Hybrid/Packaging
Booth 7-416 & 6-430
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