Machine Vision Products today demonstrated its 850G inspection solutions at the Productronica 2013 exhibition. The MVP 850G’s diverse inspection toolbox provides the highest quality inspection capabilities for multiple locations in microelectronics and packaging lines. For lead frame processes the system can be placed post die bonder, post wire bonder or post solder ball attach. In addition the system provides capability to inspect Au, Al, Ag, and Cu wires at resolutions down to 1um. The system provides full inspection for post die-bonder and post ball-bonder processes, at UPH’s that meet device cycle times. In the same inspection, the system also delivers full bond layer, die surface, die position, edge and substrate inspection. Within flip chip processes the system can be positioned post wafer bumping, post die placement, post underfill and post final packaging. It can be configured for lot solutions including magazine lifters/indexers, Jedec trays, waffle packs, and auer boats. The company’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. In addition the company also provides custom handling solutions. With specialized material handling and tools the company can typically inspect with a UPH reaching up to 25000 depending on the density of the components in a lead frame strip. The high speed, high inspection quality solution provided by MVP puts it as a leader in these markets, that was, until recently, very dependent on manual inspection. The system integrates the company’s easy-to-use programming tools and analytical process control tools. This convergence of technology delivers the best available combination of defect detection capabilities, metrology, process control and speed at a low cost of ownership.
The company continues to lead the global inspection arena by developing all of their product offerings. This provides a much better cost structure to the end user. Additionally, because all development is performed in-house, the support structure is second to none. With over 20 years of leadership, the company is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally.
Share:
