Homepage » Technology » Products »

CyberOptics to exhibit inspection solutions at SEMI Summit

Inspection and metrology
CyberOptics to exhibit inspection solutions at SEMI Summit

CyberOptics Corporation, a global developer and manufacturer of high-precision 3D sensing technology solutions, will feature its WX3000 metrology and inspection system at the Virtual Connecting Heterogeneous Systems Summit (SEMI). The event will take place from 1–3 September 2021. The system has MRS sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics.

Tim Skunes, CyberOptics VP of R&D, will share a presentation called ‘Improving Plating Uniformity for Hybrid Bonding and Micro Bumping,’ on 2 September at 8:50am (Eastern Time)/ 2:50 pm (European Central Time).

Recent results have correlated copper thickness variations across a wafer during electrochemical deposition (ECD) to variations in metal dishing depth variations in hybrid bonding applications, the company explained. Copper pillar coplanarity is also correlated to ECD plating uniformity in wafer bumping applications. The plating uniformity during ECD is directly affected by plating cell contact resistance. In-process monitoring of plating cell contact resistance can accurately predict when preventive maintenance is required to maintain thickness uniformity and save time and costs associated with test wafer measurements. A real-time sensor for measuring plating cell contact resistance will be presented.

The company will virtually demonstrate high-precision sensors that process and equipment engineers use in the front-end of the fab to speed equipment qualification, shorten equipment maintenance cycles, lower equipment expenses and optimize preventative maintenance plans.

The company’s WaferSense Auto Resistance Sensor (ARS) enables real-time resistance measurements of plating cell contacts in semiconductor Electrochemical Deposition (ECD) applications.

“Fast, 100 percent metrology and inspection is needed now more than ever for wafer-level and advanced packaging applications,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Compared to alternative technologies, our systems are 2–3X faster with the high resolution and accuracy required to enable our customers to recognize significant improvements in yields and processes.”

www.cyberoptics.com

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 5
Issue
5.2021
READ
ARCHIVE
Newsletter

Subscribe to our newsletter now

Webinars & Webcasts

First hand technical knowledge

Whitepapers

Find all current Whitepapers here

Videos

Find all current videos here


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de