Homepage » Technology » Products »

Copper wire bonders with plus for tomorrow

Products
Copper wire bonders with plus for tomorrow

Kulicke & Soffa Industries, Inc announced another extension of its highly successful K&S Power SeriesTM. The company’s new copper wire bonders, IConnPS ProCu PLUSTM and IConnPS ProCu PLUSTM LA, with proprietary upgraded and enhanced subsystems, is engineered to handle even the most challenging, leading edge copper bonding demands. The copper wire bonders come with the new ProCu5 process, which offers the highest level of copper process capability. The ProCu5 process enables robust copper wire bonding production for advanced wafer nodes below 28 nanometer. The IConnPS ProCu PLUSTM Copper Wire Bonder offers the standard 80mm bondable area with field upgradeability to an 87mm option. The IConnPS ProCu PLUSTM LA model comes with a factory configured bondable area of 87mm.

Nelson Wong, Kulicke & Soffa’s Vice President, Wire Bond Solutions Business Unit, remarked, “Customers can rely on K&S in helping meet the process challenges of copper wire bonding at advanced silicon nodes. As the global leader of the wire bond industry, K&S is committed to providing our customers with reliable, cutting-edge technology solutions that add value to their businesses. Our R&D team continues to innovate and develop new process techniques to improve portability, stability and reliability, offering our customers a cost of ownership advantage and high confidence in our products.“
Also the company announced the launch of its new ACS ProTM Capillary, for advanced copper wire bonding applications. The new ACS ProTM Capillary provides excellent bond-ability control with fine wire diameters. Using advanced material development and an innovative design, the quality and strength of both the 1st (Intermetallic Coverage) and 2nd bond are maintained over the capillary’s usable life. The ACS ProTM Capillary significantly improves design dynamics, and extends the copper process window with enhancement of process portability and response consistency. The consistent performance of the capillary eases the production fan-out process. The improved wear resistance material used for the solution also enhances workability to help drive productivity.
Nelson Wong remarked, “Kulicke & Soffa continues to leverage its strong R&D process knowledge and extensive experience in delivering copper capillaries. With ACS ProTM, customers will benefit from the excellent bond-ability control, consistent performance, while also lowering their cost of ownership. The ACS ProTM is designed to improve copper bond quality and process stability enabling process portability and response uniformity.”
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
READ
Newsletter

Subscribe to our newsletter now

Webinars & Webcasts

First hand technical knowledge

Whitepapers

Find all current Whitepapers here

Videos

Find all current videos here


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de