Engineered Material Systems, Inc., a supplier of conductive interconnect materials for photovoltaic applications, announces the introduction of its new CA-150 Series Snap Cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules.
This series is designed for use in modified ribbon stringers. The material will snap cure and fixture cells and ribbons in seconds at 150°C with enough strength to withstand module manufacturing processes until the adhesive cure is completed during the encapsulant lamination process.
The company’s CA-150 series conductive adhesives can be dispensed by time-pressure, auger or jetting. The adhesive is more stress absorbing than solder to withstand the rigors of thermal cycling and it also processes at lower temperature than solder. The conductive adhesives are less than half the cost of silver-filled conductive adhesives.
