Texas-based EMS company, BSU has updated its X-ray inspection capability with the installation of a Nikon XT V Series X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, the company said.
In making the announcement, VP of Sales and Customer Success at BSU, Dennis Leahy, said, “We will continue to incorporate X-ray technology as a standard offering in our build process here at BSU. Our XT V 160 provides high-resolution to ensure compliance with our stringent quality standards. Each board is examined at varying levels/angles, and the images are saved to become part of the manufacturing records for our customers. This provides the opportunity for us to recommend design and build efficiencies.”
He added, “This advanced X-ray system features a 5-axis part manipulation capability, which allows us to look at a component or solder connection from several different angles, and to view internal connections of molded devices or modules, for example, so that no defect will escape detection. Our quality personnel are trained and certified to operate our state of the art X-ray system and get the best possible results from our equipment.”
BSU’s services include prototyping, PCB assembly, engineering design services (EE, ME), high mix low to medium volume production; mechanical, electrical, cabling and SW/FW programming; board and functional testing, and global supply chain services.
In addition to PCBA assembly, BSU also offers box build services, wiring harness assembly, complex and simple cables and mechanical components assembly. BSU Inc’s customers span multiple industries including industrial, IoT, military and high reliability, entertainment, healthcare, education, energy and communications.
