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BGA & SMD optical inspection now for all budgets

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BGA & SMD optical inspection now for all budgets

BGA & SMD optical inspection now for all budgets
For almost a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints. Whether for inspection under flip chips or for inspection where other microscopes cannot see, Ersascope technology offers a significant added value to any quality assurance program. The Ersascope 1 is a completely new unit designed to offer the award winning, original Ersascope inspection capability at a comparatively low price. The original optics and proven stand are now augmented by a halogen light source as well as a CMOS camera. “Plug & Play” set up as well as the renowned Ersa ImageDoc Basic software package rounds off the standard, low cost package.

The Ersascope 2 goes mega pixel digital USB 2.0 and now offers 400 % more resolution! Enhanced images allow for increased clarity when zooming to high magnification especially when using the revolutionary flip chip optical head. High picture quality, increased light sensitivity and plug and play ease of use with USB 2.0 technology are the main user advantages. A new metal halide light source offers a brighter white light and a mechanical iris adapter for the additional gooseneck lighting with 2 standard fiber optic light brushes.
SMT, booth 9-330
NEW UK, booth D 90
EPP Europe 458
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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