Orthodyne Electronics announces the shipment of the first Triple-Head 7600HD Automatic Wedge Bonder system to a major power semiconductor OEM. Siegbert Haumann, the Director of Product Marketing – Equipment at Orthodyne states that “The Triple-Head 7600HD Bonder” provides a complete, capacity balanced, in-line solution for bonding PDFN power packages. The bond heads were configured as two PowerRibbon heads and one small wire head. PowerRibbon is quickly becoming the preferred interconnect choice for small dense PDFN power packages. It’s low profile can fit into thin packages, the large cross-sectional area has a lower resistance and can carry more current than round wire. The advanced leadframe handling and clamping capabilities of the system leadframe transport system were ideal for the small geometries, high density and complexity of the customer’s PDFN leadframes.”
The Automatic Wedge Bonder’s modular and flexible design can be configured in one to four head configurations depending on the line balancing requirements. The system can be easily reconfigured in the field, offering opportunities to rearrange production lines as product mix changes. For added flexibility, each bondhead can accommodate large wire, small wire or PowerRibbon.
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