The fully configured MV-7xi In-Line AOI System provides one super high resolution colour digital top down camera and four of the same fitted as side-view cameras as well as four independently programmable zones for optimal illumination of inspection areas. The MV-7xi feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. Due to the configuration with Mirtec’s Intelli-Scan Laser System, this technology provides superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. Mirtec will also present the new MV-3L Desktop AOI System, configured with one super high resolution colour digital top down camera and four of the same fitted as side-view cameras. It also features the Intelli-Beam Laser System for the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. Another new product is called MS-11 In-Line SPI System that uses Shadow Moiré Technology and Phase Stepping Image Processing to inspect solder paste deposition on PCB’s post screen print. It will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.
Productronica A2/377
eppe444
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