Little more than 30 years after the foundation of the company with headquarters in Thalwil/Switzerland Dr. Tresky Ltd. launched a solution for fully automated Die Bonding for small and medium sized production and R&D. Product diversification had continuously been brought forward in the past years: Apart from manual Pick & Place systems which the company had been well known for in the industry, the highly flexible modular T-3000 series of machines was a breakthrough in the segment of semi automated machines for multiple applications some years ago. The T-6000 has been developed for the customers’ growing demands. The machine that has emerged from a cooperation with Hilpert electronics reached its maturity phase a while ago thus a lot of in field experience is available. The development is distinctively versatile, dedicated to industrial applications and easy to operate. An automated pattern recognition, the high precision guides with standard step resolution of 1μ (Heidenhain measuring system) and 7μ placement accuracy meet all requirements of the current micro electronics assembly. Pick & Place with the T-6000 is possible from Gel Pack, Waffle Pack or from Wafers up to 8“ diameter. For the application of adhesives a pressure time dispenser and a spindle dispenser are available. An integrated database delivers different dispensing pattern. Optionally a module for epoxy stamping can be installed. With an integrated tool magazine, the fully automated tool exchange is performed quick and easy. Apart from automated operation the T-6000 can be used for manual single placement, which makes it especially versatile for applications in R & D. The multifunctional T-6000 is a useful machine for multiple applications, e.g. Die attach, Die sorting, Flip-Chip assembly, MEMS, MOEMS, VCSEL, TS bonding, eutectic bonding and many more. The specially programmed software features an intuitive and easy to use GUI. The robust stand-alone machine has been designed following ergonomic aspects and offers well accessible controls.
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