Multi-Seals is introducing an alternative to liquid adhesives for component assembly. F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, ceramics, and glass. F05 has negligible vertical flow, which keeps the adhesive contained in precisely defined areas. The pre-shaped copolymer prevents drips and dispensing inconsistencies typical of liquid adhesives. Adhesive placement is highly consistent from bond to bond. F05 can be pre-shaped in multiform configurations to accommodate a broad range of applications. The temperature and time required to process F05 depend upon component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. The minimum processing temperature is 225°F (107°C). A typical processing schedule is 275°F (135°C) for 10 minutes under 5 psi.
eppe520
Share: