Martin demonstrates the Mini-Oven Reball/Prebump unit for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow. The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone. The Expert 10.6 is a cost-effective rework system with an intuitive interface, process repeatability and semi-automated operation. A leading-edge camera driven alignment system provides a flawless solution for the automatic placement process. The hybrid platform combines both infrared and convection heating technologies to achieve outstanding board temperature uniformity, thus minimizing temperature-based PCB distortion.
SMT/Hybrid/Packaging
Stand 6-406
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