Goepel electronic introduced a brand-new system for 3D solder paste inspection named OptiCon SPI-Line 3D which provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection. The system will be offered in three different configurations determined by pixel resolutions of 10µm, 15µm and 20µm. An inspection speed of up to 90cm² can be achived. The system is fully compliant to all OptiCon AOI systems from the company, allowing for hitherto unknown opportunities in PCB production process optimization. Core element is a specifically developed 3D camera head functionally based on the fringe projection principle, operating without moving parts. In connection with a newly designed drive system for assemblies and measuring head a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed. The completely new developed user interface SPI-Pilot provides an efficient, reliable and simple programming. An offline programming station and a module for statistic process control (SPC) evaluation are offered as add-on options.
Electronica, booth A1.351
Share:
