The Phoenix X-ray high-resolution system Micromex combines features needed for comprehensive inspection of board assemblies. The machine disposes of an extra large scanning area of 20 x 24-in, precise manipulator unit with 360°-rotation axis and the company’s ovhm technology for oblique views to up to 70° at constant magnification. The specialty is the combination of these characteristics: for the first time, the operator can inspect large, mixed board assemblies, and acquire real-time oblique views under all angles (0 to 360°). A typical inspection task could be the analysis of the solder-pad wetting quality of a BGA. Another characteristic is the board-handling unit for automated loading of assembled boards. Together with the new inspection software it is possible to perform automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. This way, multiple inspection tasks can be executed and repeated in an easy, reliable und timesaving manner. The CAD-data import allows using the original PCB layout in order to teach the inspection routine. The reports can be transmitted to a rework station for rework. The SPC module allows the statistical evaluation of the inspection results and process supervision. The system features an open microfocus tube with a non-toxic target and a reportedly digital image chain with up to 4 Mpixels (resolution 1µm) and high image quality. Diverse security functions such as anti-collision system and the radiation dose minimization provide for maximum safety.
Productronica, Booth A2.277
EPP EUROPE 465
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