The Feinfocus WBI-FOX is a high-end X-ray inspection systems designed for the needs of void detection in wafer bumps. Conventional detection modalities – such as optical, laser and UV – have been used to examine a bump in terms of its volume parameters like diameter, height and roundness. However, they cannot determine the amount of true solder paste and, thus, product reliability and performance can become issues. High-res X-ray inspection is capable of properly analyzing the solder and hidden voids beneath the surface of a bump. The instrument has been tailored to meet regulatory automated handling standards for 200 and 300 mm wafers, with an automated handling system preventing any human interface of the wafers, flexible inspection processes (inspection recipes) that adjust to specific wafer characteristics, and summarized inspection results in pre-defined reports. The system offers ergonomic, user-friendly operation, with an adjustable console, fully-automated wafer loading and unloading, unattended inspection, and real-time image processing tailored to defect analysis. The system also features true X-ray intensity (TXI) control for stable and permanent image quality, an absolute necessity for real-time void inspection. Other features include:microfocus tubes up to 160 kV, graphical user interface modified for wafer bump inspection, 9-in triple-field high contrast/high res image intensifier, CCD camera, and a Windows-operated flat-panel screen.
EPP EUROPE 454
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