The bonder generation 2200 evo was developed for advanced packaging on the basis of the 2200 platform. Thanks to a dispenser system and bonding system which work in parallel in a single module with up to 7,000 CPH, the 2200 evo offers a throughput on a footprint of just 116 x 122 cm. The dispenser is not mandatory but can easily be retrofitted if required later, as can a second dispense unit. The flexible machine can process up to 25 different 300 mm wafers in a single pass. 14 different pick-up tools and 5 different ejection tools are additionally available in one module.
The 2200 evo is not just intended for die attach, but is also a fully-fledged flip-chip bonder. Further features include the heatable bonding tool, e.g. for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. This increases not only the throughput but also the yield. The tried-and-tested modular concept has also been retained in the 2200 evo. For high production volumes, several multi chip die bonders can be linked up to work in parallel.
EPP EUROPE 434
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