Henkel Technologies’ Multicore LF320 is a lead-free solder paste optimized for reflow in air. It requires a minimum peak-reflow temperature of 229 °C, versus the typical 240 °C. This 10 K advantage provides a comfortable safety margin when reflowing temperature sensitive components. However, higher Henkel Technologies’ Multicore LF320 is a lead-free solder paste optimized for reflow in air. It requires a minimum peak-reflow temperature of 229 °C, versus the typical 240 °C. This 10 K advantage provides a comfortable safety margin when reflowing temperature sensitive components. However, higher t assembly designs can still be reflowed in air at up to 260 °C with no detrimental effects. Such a low peak reflow requirement and wide profile option makes the paste suitable for high-mix, high-changeover environments. Although optimized for reflow in air, the material offers high process flexibility in inert reflow processes. With a print speed range of 25 to 100 mm and an abandon time up to two hours, it offers excellent wetting on a wide range of surface finishes. The paste has been formulated to provide high resistance to slump and solder balling. Low color residues remain allowing easy inspection. LF320 is classified as ROMO (J-STD 004) and meets or exceeds Bellcore GR-78-CORE tests for electromigration
EPP EUROPE 431
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