Some of the industry’s leading experts will explore the largest SMT manufacturing process challenges in a monthly series of free technical webcast seminars presented by Speedline Technologies. Qualified individuals can register and will be able to participate in the on-line events. Each of the monthly seminars will explore one of the challenges in a major manufacturing process – including lead-free wave and reflow, fine-pitch printing and underfill dispensing. Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the sessions will include discussions of challenges, technologies and how to implement. Each of the one-hour Thursday webcasts will be held at 11 am, U.S. Eastern Time (CET +6hrs). Participation is as easy as visiting a website and dialing into a toll-free telephone number. The schedule of remaining topics and dates include: March 17, lead-free wave soldering; April 14, lead-free reflow; May 19, lead-free reflow power & nitrogen consumption; June 16, underfill dispensing; July 21, fine-pitch printing; August 18, lead-free overview; September 15, lead-free wave soldering; October 20, lead-free reflow, November 17, tin whiskers; and December 15 with fine-pitch printing.
EPP EUROPE 413
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