To meet the high demands of users of water-soluble, lead-free solder paste that complies with the Pb-free requirements, Indium Corporation has developed the next generation of paste for reflow processing. The Indium3.1 is a water-soluble, Pb-free solder paste with advanced printing capability, ideal for fine-pitch applications. The reportedly exceptional stencil life virtually eliminates paste wastage. The formulation demonstrates excellent wetting under both air and nitrogen atmosphere, with any residue easily cleaned with water. The resultant solder joints are shiny and smooth, including those of ultra fine-pitch components. Indium3.1 is said to also feature a wide reflow window, outstanding slump resistance, low voiding and low foaming. Standard packing for stencil-printing applications is 500g jars and 700g cartridges. The use of the paste is internationally backed by Indium’s experienced engineers who provide in-depth technical assistance and expert advice in solder properties.
EPP EUROPE 425
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