The Zymet reworkable underfill encapsulant CN-1432 is designed for CSP and BGA packages that are normally not encapsulated. However, it has been found that mobile electronics require encapsulation of these components to survive drop tests and repeated keypad actuations. Removal of defective CSPs and BGAs is easily accomplished by heating the component and the underfill encapsulant to 220°C. The residues are easily scraped or brushed off. The material has a viscosity of 4500cps at room temperature, making it very easy to dispense. It is also fast flowing, capable of passing a distance of 18mm with only a single-side dispense in just 15 sec. Reportedly, the encapsulant exhibits excellent wetting properties. It self-fillets, eliminating the need for seal passes to create complete and symmetrical fillets. The material can be cured in an oven in 5 minutes at 165°C. This processability makes it suited to high-volume manufacturing.
EPP EUROPE 440
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