Orthodyne introduces its PowerRibbon interconnect technology for power semiconductors and modules. PowerRibbon replaces the large aluminum wires or other means used up to now, which are less flexible and less reliable than wire bonding and usually need extensive redesign and requalification. This novel technology works with current package designs for aluminum wire but replaces them with ribbons using an ultrasonic interconnect process similar to traditional wire bonding. It combines the flexibility and robustness of wire bonding with a performance similar to copper dip bonding. The technique can be retrofitted to any Orthodyne M360C wire bonder. Ribbon sizes from 30 x 3 mil up to 80 x 8 mil are currently available.
EPP EUROPE 440
www.orthodyne .com
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